DeWeyl Tool 33282 Wire Bonding Wedge, Ceramic, Series RN-V
Our Part #572IE282
Mfr Part #33282
DeWeyl Tool 33282 Wire Bonding Wedge, Ceramic, Series RN-V
Our Part #572IE282
Condition:New
Mfr Part #33282
$317.00EACH
| Qty: | Price: | Savings |
|---|---|---|
| 1 | $317.00 | |
| 2 | $301.15 | Save |
| 5 | $285.30 | Save |
| 10 | $278.96 | Save |
Condition:New
- Description
- Specifications
- Documents
- Ribbon bonding wedge for gold and aluminum wire
- Vertical feed - offers solution in maintaining maximum looping and tail control
- Front/Back radius: .0005 x .0005
- Foot type: Cross groove
- Ribbon size: 1x .003
- Bond length: .0030
- Foot finish: Matte (FR, BR & Bond flat)
- A2 Side Chamfer W .0045, A4 Front Step, A9 Back Chamber MAX
DeWeyl's bonding wedge for microelectronics is designed for the placing and bonding of fine aluminum and gold wires during the assembly of integrated circuits. Ceramic offers a surface texture that couples with the wire giving optimum ultrasonic transfer. Difficult applications due to low bonding temperatures or a contaminated bond surfaces are made easier. It's used throughout the semiconductor, microwave, disk drive and hybrid electronic industries.
Brand: DeWeyl Tool
Angle: Hole 55°
Application Method: Ultrasonic bonding
Material: Ceramic
Note: DeWeyl order ID: MRNVB-1/16-828-55-CG-1X3-3-M-A2-A4-A9-A2=W=.0045-A4=FS= A9=C=MAX
Series: RN-V Series
Shank Diameter: 1/16
Shank Type: Tungsten Carbide
$317.00EACH
| Qty: | Price: | Savings |
|---|---|---|
| 1 | $317.00 | |
| 2 | $301.15 | Save |
| 5 | $285.30 | Save |
| 10 | $278.96 | Save |